Electronic Component Package.

Because of the delicacy of the silicon components, they require additional protection for proper operation. the function of the encapsulated chips are mainly 4:

1. Protect semiconductors climatic adversities and shock (water, light, powder...)

2. Dissipate heat to allow for optimal performance.

3. Improving the electric connectivity thanks to the incorporation of metal pins.

4. Improve handling and assembly of chips on circuit boards.

Package: Most Popular Encapsulates

DIP: The pins extend along the encapsulated (both sides) and like everyone else has a notch indicating pin number 1.

SIP: pins extending along one side of the package and is mounted vertically on the plate. The conseguiente reduction in mounting area allows for higher mounting density that obtained with DIP.

PGA: The multiple connector pins are located on the bottom of the package. This type is used for PC CPUs and was the main choice when considering efficiency pin-to-space capsule.

TCP: The silicon chip is encapsulated in the form of film tapes can be produced in different sizes, the encapsualdo can be folded. They are mainly used for the LCD drivers.